Product Summary:

After encapsulation (COS, TO56, C-mount, F-mount, CCP, butter-fly, etc.), semiconductor laser chip devices are carried out on a controlled temperature workbench.

- Realize long-term life test and short-term aging test for high-power COS, C-mount and TO package modules with good patch

- Long-term life test type: it can perform accelerated life test on 100 devices at the same time, and monitor optical power and wavelength of each device

- Short-term aging type: can perform short-term aging test on 250 devices at the same time, without monitoring optical power and wavelength

- Hybrid: the first equipment in the industry to combine long-term life testing and short-term aging testing

- Standard current range 0-18A (maximum current up to 30A when the total load power is relatively small)

Product features:

- High integration (100pcs high-power laser chip can be tested at the same time)

- Monitor and record the state of laser chip at each station in real time: laser power, peak wavelength and spectral width

- Excellent internal clean environment (100-1000)

- Good safety protection and fault warning mechanism

- Real-time monitoring and recording of equipment operating status: temperature at multiple points, cooling water flow, power current & voltage

- Friendly man-machine interface, simple operation, easy to use

- Provides special software for offline aging data analysis

- Provides the function of stopping and restarting the aging test during the test

- The number of laser chips can be increased or reduced flexibly, and the aging time of each laser chip can be accumulated independently